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  APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 1 C 6 pins 5/6/15/16 ; 3/4/17/18 ; 9/10 ; 11/12 must be shorted together all ratings @ t j = 25c unless otherwise specified absolute maximum ratings (per igbt) symbol parameter max ratings unit v ces collector - emitter breakdown voltage 600 v t c = 25c 100 i c continuous collector current t c = 80c 75 i cm pulsed collector current t c = 25c 140 a v ge gate C emitter voltage 20 v p d maximum power dissipation t c = 25c 250 w rbsoa reverse bias safe operating area t j = 150c 150a @ 550v these devices are sensitive to electrostatic discharge. proper handling procedures should be followed. see application note apt0502 on www.microsemi.com application ? welding converters ? switched mode power supplies ? uninterruptible power supplies ? motor control features ? trench + field stop igbt3 technology - low voltage drop - low tail current - switching frequency up to 20 khz - soft recovery parallel diodes - low diode vf - low leakage current - rbsoa and scsoa rated ? very low stray inductance ? internal thermistor for temperature monitoring ? high level of integration benefits ? outstanding performance at high frequency operation ? direct mounting to heatsink (isolated package) ? low junction to case thermal resistance ? solderable terminals both for power and signal for easy pcb mounting ? low profile ? rohs compliant full - bridge trench + field stop igbt3 power module v ces = 600v i c = 75a @ tc = 80c downloaded from: http:///
APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 2 C 6 electrical characteristics (per igbt) symbol characteristic test conditions min typ max unit i ces zero gate voltage collector current v ge = 0v, v ce = 600v 250 a t j = 25c 1.5 1.9 v ce(sat) collector emitter saturation voltage v ge =15v i c = 75a t j = 150c 1.7 v v ge(th) gate threshold voltage v ge = v ce , i c = 600a 5.0 5.8 6.5 v i ges gate C emitter leakage current v ge = 20v, v ce = 0v 600 na dynamic characteristics (per igbt) symbol characteristic test conditions min typ max unit c ies input capacitance 4620 c oes output capacitance 300 c res reverse transfer capacitance v ge = 0v v ce = 25v f = 1mhz 140 pf q g gate charge v ge =15v, i c =75a v ce =300v 0.8 c t d(on) turn-on delay time 110 t r rise time 45 t d(off) turn-off delay time 200 t f fall time inductive switching (25c) v ge = 15v v bus = 300v i c = 75a r g = 4.7 ? 40 ns t d(on) turn-on delay time 120 t r rise time 50 t d(off) turn-off delay time 250 t f fall time inductive switching (150c) v ge = 15v v bus = 300v i c = 75a r g = 4.7 ? 60 ns t j = 25c 0.35 e on turn-on switching energy t j = 150c 0.6 mj t j = 25c 2.2 e off turn-off switching energy v ge = 15v v bus = 300v i c = 75a r g = 4.7 ? t j = 150c 2.6 mj i sc short circuit data v ge 15v ; v bus = 360v t p 6s ; t j = 150c 380 a r thjc junction to case thermal resistance 0.60 c/w downloaded from: http:///
APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 3 C 6 reverse diode ratings and characteristics (per diode) symbol characteristic test conditions min typ max unit v rrm maximum peak repetitive reverse voltage 600 v i rm maximum reverse leakage current v r =600v 250 a i f dc forward current tc = 80c 75 a t j = 25c 1.6 2 v f diode forward voltage i f = 75a v ge = 0v t j = 150c 1.5 v t j = 25c 100 t rr reverse recovery time t j = 150c 150 ns t j = 25c 3.6 q rr reverse recovery charge t j = 150c 7.6 c t j = 25c 0.85 e r reverse recovery energy i f = 75a v r = 300v di/dt =2000a/s t j = 150c 1.8 mj r thjc junction to case thermal resistance 0.98 c/w temperature sensor ntc symbol characteristic min typ max unit r 25 resistance @ 25c 22 k ? ? r 25 /r 25 resistance tolerance 5 ? b/b beta tolerance 3 % b 25/100 t 25 = 298.16 k 3980 k ? ?? ? ? ?? ? ? ?? ? ? ?? ? ? ? t t b r r t 1 1 exp 25 100/25 25 thermal and package characteristics symbol characteristic min typ max unit v isol rms isolation voltage, any terminal to case t =1 min, 50/60hz 4000 v t j operating junction temperature range -40 175 t stg storage temperature range -40 125 t c operating case temperature -40 100 c torque mounting torque to heatsink m4 2 3 n.m wt package weight 75 g t: thermistor temperature r t : thermistor value at t downloaded from: http:///
APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 4 C 6 package outline (dimensions in mm) typical performance curve forward characteristic of diode t j =25c t j =125c t j =150c 0 25 50 75 100 125 150 00.40.81.21.622.4 v f (v) i f (a) hard switching zcs zvs 0 20 40 60 80 100 120 02 04 06 08 01 0 0 i c (a) fmax, operating frequency (khz) v ce =300v d=50% r g =4.7 ? t j =150c t c =85c operating frequency vs collector current maximum effective transient thermal impedance, junction to case vs pulse duration d = 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.2 0.4 0.6 0.8 1 1.2 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration in seconds thermal impedance (c/w) diode downloaded from: http:///
APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 5 C 6 output characteristics (v ge =15v) t j =25c t j =25c t j =150c 0 25 50 75 100 125 150 0 0.5 1 1.5 2 2.5 3 v ce (v) i c (a) output characteristics v ge =15v v ge =13v v ge =19v v ge =9v 0 25 50 75 100 125 150 00.511.522.533.5 v ce (v) i c (a) t j = 150c transfert characteristics t j =25c t j =25c t j =150c 0 25 50 75 100 125 150 5 6 7 8 9 10 11 12 v ge (v) i c (a) energy losses vs collector current eon eoff er 0 1 2 3 4 5 0 25 50 75 100 125 150 i c (a) e (mj) v ce = 300v v ge = 15v r g = 4.7 ? t j = 150c eon eoff er 0 1 2 3 4 5 0 5 10 15 20 25 30 35 40 gate resistance (ohms) e (mj) v ce = 300v v ge =15v i c = 75a t j = 150c switching energy losses vs gate resistance reverse bias safe operating area 0 25 50 75 100 125 150 175 0 100 200 300 400 500 600 700 v ce (v) i c (a) v ge =15v t j =150c r g =4.7 ? maximum effective transient thermal impedance, junction to case vs pulse duration d = 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration in seconds thermal impedance (c/w) igbt downloaded from: http:///
APTGT75H60T2G APTGT75H60T2G C rev 1 october 2012 www.microsemi.com 6 C 6 disclaimer the information contained in the document (unless it is publicly available on the web without access restrictions) is proprietary and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the term s of such agreement will also apply. this document and the information contained herein may not be modified, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication , inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an officer of microsemi. microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with life- support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microsemi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or custo mers final application. user or customer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp life support application seller's products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the seller's product could create a situation where personal injury, death or property damage or loss may occur (collectively "life support applications"). buyer agrees not to use products in any life support applications and to the extent it does it shall conduct extensive testing of the product in such applications and further agrees to indemnify and hold seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, dam ages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in life support applications, even if such claim includes allegations that seller was negligent regarding the design or manufacture of the goods. buyer must notify seller in writing before using sellers products in life support applications. seller will study with buyer alternative solutions to meet buyer application specification based on sellers sales conditions applicable for the new proposed specific part. downloaded from: http:///


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